Micro Nano Devices & Systems Lab

Publications

 Journal Publications

    Year 2016

  1. Yan, Z., Chen, L., Yoon, M., and Kumar, S. “The Role of Interfacial Electronic Properties on Phonon Transport in Two-Dimensional MoS2 on Metal Substrates,” ACS Applied Materials & Interfaces, 8 (48), 33299–33306, 2016. [PDF]

  2. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “Solid–Liquid Thermal Transport and Its Relationship with Wettability and the Interfacial Liquid Structure”, The Journal of Physical Chemistry Letters, 7, 3497–3501, 2016. [PDF]

  3. Huang H., Chen L., Varshney V., Roy A., Kumar, S. “Investigation of Phonon Transport and Thermal Boundary Conductance at the Interface of Functionalized SWCNT and Poly (ether-ketone)”, Journal of Applied Physics, 120, 095102, 2016. [PDF]

  4. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “Wettability transparency and the quasiuniversal relationship between hydrodynamic slip and contact angle”, Applied Physics Letters,2016.  [PDF]

  5. Yan, Z., Chen, L., Yoon, M., Kumar, S.. “Phonon Transport at the Interfaces of Vertically Stacked Graphene and Hexagonal Boron Nitride Heterostructures.” Nanoscale, 2016, 8, 4037-4046 [PDF]

  6. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “The hydrodynamic slip length as a surface property”, Physical Review E 93, 023101, 2016. [PDF]

  7. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “On the wettability transparency of graphene-coated silicon surface”, The Journal of Chemical Physics 144(1), 014701, 2016. [PDF]

  8. Year 2015

  9. Chen L., Wang X., Kumar S., “Thermal Transport in Fullerene Derivatives Using Molecular Dynamics Simulations,” Scientific Reports, 5, 2015. [PDF]

  10. Lee K., Brown D., Kumar S., “Silicon Nanowire Arrays Based On-Chip Thermoelectric Generators,” IEEE TransactionsComponents on Packaging and Manufacturing Technology, 5(8),2015. [PDF]

  11. Joshi, Y.; Yalamanchili, S.; Kumar, S.; Ghosh, R.; Barabadi, B., “Thermal Simulations in Support of Mulit-scale Co-design of Energy Efficient Information Technology Systems", International Journal of Numerical Methods for Heat and Fluid Flow, 2015. [PDF]

  12. Matthew, R., and Kumar, S., “Optimization of Thermoelectric Coolers for Hotspot Cooling in 3D Stacked Chips,” ASME Journal of Electronic Packaging, 137, 011006, 2015. [PDF]

  13. Ramos-Alvarado, B., Kumar, S., Peterson, G. P., “Wettability of graphitic-carbon and silicon surfaces: MD modeling and theoretical analysis”, The Journal of Chemical Physics, 143, 044703, 2015. [PDF]

  14. Barabadi, B., Kumar, S., Sukharev, V., Joshi, Y., “Multiscale Transient Thermal Analysis of Microelectronics”, Journal of Electronic Packaging, 137, 031002-1, 2015. [PDF]

  15. Year 2014

  16. Chen, L., Huang, Z., and Kumar, S., "Impact of Bonding at Multi-layer Graphene/metal Interfaces on Thermal Boundary Conductance." RSC Advances, 4(68), 2014. [PDF]

  17. Sullivan, O., Gupta, M., Mukhopadhyay, S., Kumar, S., “On-Chip Power Generation Using Ultrathin Thermoelectric Generators,” ASME Journal of Electronic Packaging, 137 (1), 011005, 2014. [PDF]

  18. Chen, X., Donmezer, F., Kumar, S., and Graham, S., “A Numerical Study on Comparing the Active and Passive Cooling of AlGaN/GaN HEMTs, IEEE Transactions on Electron Devices, 61, 12, 2014. [PDF]

  19. Sadasivam, S., Che, Y., Huang, Z., Liang, C., Kumar, S., and Fisher, T. S., “The Atomistic Green's Function Method for Interfacial Phonon Transport,” Annual Review of Heat Transfer, 17, 89-145, 2014,  (Invited)" [DOI: 10.1615/AnnualRevHeatTransfer.2014006986] [PDF]

  20. Chen, L., and Kumar, S., “Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate," Journal of Heat Transfer, 136(5), 052401 2014;  [PDF]

  21. Salazar, P. F., Kumar, S., and Cola, B. A., “Design and optimization of thermo- electrochemical cells,” J. Appl. Electrochem., 44 (2), 325-336, 2014. [PDF]

  22. Year 2013

  23. Liang, C., Huang, Z., and Kumar, S., “Phonon Transmission and Thermal Conductance across Graphene/Cu Interface," Applied Physics Letters, 103, 123110, 2013. [PDF]

  24. Gupta, M. P., Behnam, A., Lian, F., Estrada, D., Pop, E., and Kumar, S., “High Field Breakdown Characteristics of Carbon Nanotube Thin Film Transistors,” Nanotechnology, 24, 405204, 2013. [PDF]

  25. Alexandrov, B., Sullivan, O., Kumar, S., and Mukhopadhyay, S., “Control Principles and On-chip Circuits for Active Cooling using Integrated Super Lattice Based Thin-Film Thermoelectric Devices,” IEEE Transaction on VLSI System, 2013. [doi: 10.1109/TVLSI.2013.2278951] [PDF]

  26. Sullivan, O., Alexandrov, B., Mukhopadhyay, S., and Kumar, S., “3D Compact Model of Packaged Thermoelectric Coolers,” ASME Journal of Electronic Packaging, 135, 031006, 2013. [PDF]

  27. Matthew, R., Manickaraj, K., Sullivan, O., Mukhopadhyay, S. and Kumar, S., “Hotspot Cooling in Stacked Chips using Thermoelectric Coolers,” IEEE Transactions on Components and Packaging Technologies, 3 (5), 759-767, 2013. [PDF]

  28. Cho, M., Kersey, C., Gupta, M. P., Sathe, N., Kumar, S., Yalamanchili, S., and Mukhopadhyay, S., “Power Multiplexing for Thermal Field Management in Many Core Processors,” IEEE Transactions on Components and Packaging Technologies, 3(1), 94-104, 2013. [PDF]

  29. Year 2012

  30. Gupta, M. P., Liang, C., Estrada, D., Behnam, A., Pop, E., and Kumar, S.., “Impact of Thermal Boundary Conductances on Power Dissipation and Electrical Breakdown of Carbon Nanotube Network Transistors,” Journal of Applied Physics, 112, 124506, 2012[PDF]

  31. Liang, C., and Kumar, S., “Thermal Transport in Graphene Supported on Copper,” Journal of Applied Physics, 112, 043502, 2012. [PDF]

  32. Barabadi, B., Joshi, Y. K., Kumar, S., and Ahmed, G. R., “Interconnect Joule Heating Under Transient Currents Using Transmission Line Method,” ASME Journal of Electronic Packaging, 134, 011009, 2012. [PDF]

  33. Gupta, M. P., Cho, M., Mukhopadhyay, S., and Kumar, S., “Thermal Investigation into Power Multiplexing for Homogeneous Many-Core Processors,” Journal of Heat Transfer, 134, 061401, 2012. [PDF]

  34. Sullivan, O., Gupta, M. P., Mukhopadhyay, S., and Kumar, S., “Array of Thermoelectric Coolers for On-Chip Thermal Management,” ASME Journal of Electronic Packaging, 134, 021005, 2012. (Invited) [PDF]

  35. Salazar, P. F., Kumar, S., and Cola, B. A., “Nitrogen- and Boron-Doped Carbon Nanotube Electrodes in a Thermo-Electrochemical Cell,” Journal of Electrochemical Society, 159 (5), B483-B488, 2012. [PDF]

  36. Chatterjee S., Salahuddin S., Kumar S., and Mukhopadhyay S., “Impact of Self-Heating on Reliability of Spin-Torque-Transfer RAM Cell,” IEEE Transactions of Electron Devices,  59 (3), 791-799, 2012.  [PDF]

  37. Year 2011

  38. Liang, C., and Kumar, S., “Thermal Transport in Double-Wall Carbon Nanotubes using Heat Pulse,” Journal of Applied Physics, 110, 074305, 2011. [PDF] 

  39. Gupta, M. P., Sayer, M., Mukhopadhyay, S., and Kumar, S., “Ultrathin Thermoelectric Devices for On-Chip Peltier Cooling,” IEEE Transactions on Components and Packaging Technologies, 1 (9), 1395-1405, 2011. [PDF]

  40. Kumar, S., Cola, B. A., Jackson, R. and Graham S., Carbon Nanotubes: A Review of Electronic, Thermal and Optical Aspects, ASME Journal of Electronic Packaging, 133 (2), 020906, 2011. (Invited) [PDF]

  41. Kumar, S., N. Pimparkar, Murthy, J. Y., and Alam, M. A. Self-consistent Electrothermal Analysis of Nanotube Network Transistors, Journal of Applied Physics, 109, 014315, 2011. [PDF]

  42. Before Year 2009

  43. Kumar, S., and Murthy, J. Y., Interfacial Thermal Transport between Nanotubes, Journal of Applied Physics, 106, 084302, 2009. [JAP]

  44. Kumar, S., Murthy, J. Y., and Alam, M. A., Electrical and Thermal Transport in Thin Film Nanotube Composites with Applications to Macro-Electronics, International Journal of Nanomanufacturing, 2 (3), 2008. (Invited)

  45. Kumar, S., Alam, M. A., and Murthy, J. Y., Effect of Percolation on Thermal Transport in Nanotube Composites, Applied Physics Letters, 90, 104105, 2007. [PDF]

  46. Kumar, S., Alam, M. A., and Murthy, J. Y., Computational Model for Transport in Nano-tube Based Composite with Applications to Flexible Electronics, Journal of Heat Transfer, 129, 500-508, 2007. [PDF]

  47. Pimparkar, N., Kumar, S., Cao, Q., Murthy, J. Y., Rogers, J. A., and Alam, M. A., Current-Voltage Characteristics of Long-Channel Nanobundle Thin-Film Transistors: A Bottom-up Perspective, Electron Device Letters, 28, 157-160, 2007. [PDF]

  48. Kumar, S., Acharya, S., Deposition of Particles on Ocular Tissues and the Formation of Krukenberg Spindle, Hyphema and Hypopyon, ASME Journal of Biomechanical Engineering, 129, 174-186, April 2007. [PDF]

  49. Kumar, S., Acharya, S., Beuerman, R., and Palkama, A., Numerical Solution of Ocular Fluid Dynamics in a Rabbit Eye: Parametric Effects, Annals of Biomedical Engineering, 34 (3), 530-533, March 2006. [PDF]

  50. Kumar, S., Pimparkar, N., Murthy, J. Y., and Alam, M. A., Theory of Transfer Characteristics of Nanotube Network Transistors, Applied Physics Letters, 88, 123505, March 2006. [PDF]

  51. Alam, M. A., Pimparkar, N., Kumar, S., and Murthy, J. Y., Theory of Nanocomposite Network transistors for Macroelectronics Applications, MRS Bulletin, 466-470, 31, June 2006. [PDF]

  52. Kumar, S., Murthy, J. Y., and Alam, M. A., Performance of Carbon Nanotube-Dispersed Thin-Film Transistors, Applied Physics Letters, 89, 143501, 2006. [PDF]

  53. Kumar, S., and Murthy, J. Y., A Numerical Technique for Computing Effective Thermal Conductivity of Fluid-Particle Mixtures, Numerical Heat Transfer B, 47, 552-572, 2005.

  54. Kumar, S., Murthy, J. Y., and Alam, M. A., Percolating Conduction in Finite Nano-tube Networks, Physical Review Letters, 95, 066802, August 2005. [PDF]

Conference Publications (Referred)

  1. Mok S., Joshi Y. K., Kumar S., and Hutchins, R. R., "Impact of a Rotary Regenerative Heat Exchanger on Energy Efficiency of an Air Cooled Data Center", IEEE Thermal and Thermo-mechanical Phenomena in Electronics Systems (ITHERM), May 31 – June 3, 2016, Las Vegas, NV, USA.

  2. Vallabhaneni A., Gupta M., and Kumar S., “Effect of Ballistic Thermal Transport in High Electron Mobility Transistors", ITHERM, May 31 – June 3, 2016, Las Vegas, NV, USA.

  3. Huang, H.X., Kumar, S., Varsheney, V., Roy, A."Investigation of Phonon Transport and Thermal Boundary Conductance at Interface of Functionalized SWCNT and Poly (Ether-Ketone)" Third International Conference on Computational Methods for Thermal Problems, ThermaComp2016, July 6-8, 2016, Atlanta, USA.

  4. Mok S., Joshi Y. K., Kumar S., and Hutchins, R. R., “Energy Simulation of Data Centers with Hybrid Liquid/Air Cooling and Waste Heat Re-Use,” IMECE, Nov 11-17, 2016, Phoenix, Arizona, USA.

  5. Chen, L., and Kumar, S., "Electron-Phonon Transport in Graphene Devices ," CHT-15, the 6th International Symposium on Advances in Computational Heat Transfer, July 2015, Rutgers University, Piscataway, NJ, USA.

  6. Banerjee, S., Gupta, M., Kumar, S., Chatterjee, A.,“Digitally-Compatible Ring Oscillator Frequency Driven Tuning of CN-TFT Amplifiers: Performance Compensation Under Statistical and Morphological Variations”, IEEE International Mixed-Signal Test Workshop 2015, Paris, France.

  7. Brown, D. B., Bougher, T. L., Cola, B. A., and Kumar, S., “Thermal boundary conductance at metal-graphene-metal interfaces using time-domain thermoreflectance method,” ASME InterPACKICNMM, July 6-9, 2015, San Francisco, CA, USA.

  8. Lee, K. Y., Brown, D., and Kumar, S., “Performance Evaluation of Silicon Nanowire Arrays Based Thermoelectric Generators,” IEEE Thermal and Thermo-mechanical Phenomena in Electronics Systems (ITHERM), May 27-30, 2014, Orlando, FL, USA

  9. Gupta, M., Behnam, A., Estrada, D., Pop, E., Kumar, S., “High Field Breakdown of Carbon Nanotube Network Transistors”, ASME InterPACK, Burlingame, CA, July 2013

  10. Gupta, M., Kumar, S., "Dissipative Particle Dynamics Study of Liquid Crystals under Electric Field", ASME MNHMT 2013, Hongkong, China

  11. Barabadi, B., Joshi, Y. K., and Kumar, S., “Rapid Multiscale Transient Thermal Modeling of Packaged Microprocessors Using Hybrid Approach,” 14th Electronics Packaging Technology Conference (EPTC), December 5-7, 2012, Resort Worlds Sentosa, Singapore. (Invited)

  12. Liang, C., and Kumar, S., “Heat Dissipation Mechanism at Supported CNT-CNT Junctions,” ASME Summer Heat Transfer Conference, July 8-12, 2012, Rio Grande, Puerto Rico.

  13. Sullivan, O., Mukhopadhyay, S., and Kumar, S., “Thermoelectric Generators Embedded in Microelectronic Chip,” ASME International Mechanical Engineering Congress & Exposition (IMECE), November 9-15, 2012, Houston, TX, USA.

  14. Barabadi, B., Kumar, S., Sukharev, V., and Joshi, Y. K., “Multi-scale Transient Thermal Analysis of Microelectronics,” IMECE, November 9-15, 2012, Houston, TX, USA.

  15. Liang, C., and Kumar, S., “Thermal Transport in Graphene Supported on Copper,” 3rd Micro-Nanoscale Heat and Mass Transfer International Conference (MNHMT), March 3-6, 2012, Atlanta, GA, USA.

  16. Gupta, M. P., Estrada, D., Pop, E., and Kumar, S., “Impact of Contact Resistances on Electrical and Thermal Transport in Carbon Nanotube Network Transistors,” MNHMT, March 3-6, 2012, Atlanta, GA, USA.

  17. Barabadi, B., Kumar, S, and Joshi, Y. K., “Transient Thermal Analysis of Three-dimensional Interconnect Structures Using Proper Orthogonal Decomposition Method,” MNHMT, March 3-6, 2012, Atlanta, GA, USA.

  18. Alexandrov, B., Sullivan, O., Kumar, S., and Mukhopadhyay, S., “Prospects of Active Cooling with Integrated Super-Lattice based Thin-Film Thermoelectric Devices for Mitigating Hotspot Challenges in Microprocessors,” 17th Asia and South Pacific Design Automation Conference, January 30- February 2, 2012, Sydney, Australia.

  19. Matthew, R., Manickaraj, K., Sullivan, O., and Kumar, S., “Thermoelectric Coolers for Hostspot Thermal Management of 3D Stacked Chips,” ASME International Mechanical Engineering Congress & Exposition (IMECE), November 11-17, 2011, Denver, CO, USA.

  20. Sullivan, O., Alexandrov, B., Mukhopadhyay, S., and Kumar, S., “Compact Model of Thermoelectric Coolers on a Micro-electronic Chip,” IMECE, November 11-17, 2011, Denver, CO, USA. Gupta, M. P., Cho, M., Mukhopadhyay, S., and Kumar, S., An Investigation into Power Migration Policies in Many-Core Processors to Manage On-chip Thermal Profile, InterPACK, July 6-8, 2011, Portland, Oregon, USA.

  21. Barabadi, B., Joshi, Y. K., and Kumar, S, Prediction of Transient Thermal Behavior of Planar Interconnect Architecture using Proper Orthogonal Decomposition Method,InterPACK, July 6-8, 2011, Portland, Oregon, USA.

  22. Barabadi, B., Joshi, Y. K., and Kumar, S, Characterization of Steady and Transient Heating of Interconnects- A Review, IRPS, April, 2011, Austin, Texas, USA.

  23. Cho, M., Sathe, N., Gupta, M., Kumar, S., Yalamanchilli, S. and Mukhopadhyay, S.,Proactive Power Migration to Reduce Maximum Value and Spatiotemporal Non-uniformity of On-chip Temperature Distribution in Homogeneous Many-Core Processors, SEMITHERM 2010, February 21-25, 2010, Santa Clara, CA  USA.

  24. Gupta, M. P., Cho, M., Mukhopadhyay, S., and Kumar, S., Thermal Management of Multicore Processors using Power Multiplexing, ITHERM, June 2-5, 2010, Las Vegas, Nevada, USA.

  25. Gupta, M. P., Sayer, M. S., Mukhopadhyay, S., and Kumar, S., On-chip Peltier Cooling using Current Pulse, ITHERM, June 2-5, 2010, Las Vegas, Nevada, USA.

  26. Barabadi, B., Joshi, Y. K., Kumar, S., and Ahmed, G. R., Thermal Characterization of Planar Interconnect Architectures under Different Rapid Transient Currents using the Line Matrix and Finite Element Methods, ITHERM, June 2-5, 2010, Las Vegas, Nevada, USA.

  27. Chatterjee S., Salahuddin S., Kumar S., and Mukhopadhyay S., Analysis of Thermal Behaviors of Spin-Torque-Transfer RAM: A Simulation Study, International Symposium on Low Power Electronics and Design (ISLPED), August 18-20, 2010, Austin, Texas, USA.

  28. Sullivan, O., Gupta, M., Mukhopadhyay, S., and Kumar, S., Thermoelectric Coolers for Thermal Gradient Management on Chip, ASME International Mechanical Engineering Congress & Exposition (IMECE), November 12-18, 2010, Vancouver, Canada.

  29. Liang, C., and Kumar, S., Heat Pulse Analysis in Single-Wall and Double-Wall Carbon Nanotubes, ASME International Mechanical Engineering Congress & Exposition (IMECE), November 12-18, 2010, Vancouver, Canada.

  30. Kumar, S., and Murthy, J. Y., Interfacial Thermal Transport between Nanotubes, ASME Summer Heat Transfer conference, July 19-23, 2009, San Francisco, California, USA.

  31. Barabadi, B., Joshi, Y. K., Kumar, S., and Ahmed, G. R., Thermal Characterization of Planar Interconnect Architectures under Transient Currents, ASME International Mechanical Engineering Congress and Exposition, November 17-21, 2009, Lake Buena Vista, Florida, USA.

  32. Chatterjee S., Salahuddin S., Kumar S., and Mukhopadhyay S., Modeling of the Self-Heating in STTRAM and Analysis of its Impact on Reliable Memory Operations, NVMTS 2009, Portland, Oregon, Oct. 25-28.

  33. Kumar, S., Alam, M. A., and Murthy, J. Y., Percolation effects on the thermal conductivity of 3D Nanotube Composites, ASME International Mechanical Engineering Congress and Exposition, October 31-November 6, 2008, Boston, Massachusetts, USA.

  34. Kumar, S., Joshi, R. V., Chuang, C. T., Keunwoo, K., and Murthy, J. Y., Leakage Analysis for FinFet Devices using Self-Consistent Electro-Thermal Modeling, ICICDT, May 30 - June 1, 2007, Austin, Texas, USA.

  35. Kumar, S., Alam, M. A., and Murthy, J. Y., Numerical Model for Thermal Transport in 3D Nanotube Composites, InterPACK, July 8-12, 2007, Vancouver, British Columbia, CANADA.

  36. Alam, M. A., Pimparkar, N., Kumar, S., and Murthy, J. Y., Percolation and Fractal Geometry: How Spatial Inhomogeneity is Reshaping Modern Semiconductor Devices, Device Research Conference, Notre Dame, Indiana, June 20-22, 2007.

  37. Kumar, S., Joshi, R. V., Chuang, C. T., Keunwoo, K., and Murthy, J. Y., Schonenberg, K. T., and Nowak, E. J., Self-Consistent and Efficient Electro-Thermal Analysis for Poly/Metal Gate FinFets, IEDM, December 11-13, 2006, San Francisco, California, USA.

  38. Kumar, S., Alam, M. A., and Murthy, J. Y., Computational Thermal Model for Nanotube Based Electronic Display, ITHERM, May 30-June 2, 2006, San Diego, California, USA.

  39. Alam, M. A., Pimparkar, N., Kumar, S., and Murthy, J. Y., The Short and Long Channel Pick-up Stick Transistors: A Promising Technology for Micro- and Macro-Electronics, ISDRS, December 2005.

  40. Kumar, S., Alam, M. A., and Murthy, J. Y., Thermal Transport in Nanotube Composites for Large-Area Macroelectronics, Proceedings of HT, ASME Summer Heat Transfer conference, July 17-22, 2005, San Francisco, California, USA.

  41. Kumar, S., Acharya, S., Numerical Solution of Iridectomy for Surgical Treatment of Glaucoma, Proceedings of NHTC, ASME Summer Heat Transfer conference, July 11-15, 2004, Charlotte, North Carolina, USA.

  42. Kumar, S., Murthy, J. Y., A Numerical Technique for Computing Effective Thermal Conductivity of Fluid-Particle Mixtures, Proceedings of IMECE, ASME International Mechanical Engineering Conference, Nov. 13-19, 2004, Anaheim, California, USA.

  43. Kumar, S., Alam, M. A., and Murthy, J. Y., Simulation of Thermal Transport in Nano-wire Composites for Macro-Electronics Applications, Proceedings of Integrated Nanosystems, ASME Conference, September 22-24, 2004, Pasadena, California, USA.

  44. Kumar, S., Acharya, S., Prediction of Particle Deposition on Ocular Tissues and the Formation of Krukenberg Spindle, Hyphema and Hypopyon, Proceedings of IMECE,ASME International Mechanical Engineering Conference, November 13-19, 2004, Anaheim, California, USA.

  45. Kumar, S., Acharya, S., Beuerman, R., and Palkama, A., Numerical Solution of Ocular Fluid Dynamics in Rabbit Eye, Proceedings of NHTC, ASME Summer Heat Transfer conference, July 21-23, 2003, Las Vegas, California, USA.

 

Presentations Only

  1. Kumar, S, “Carbon Nanotube Networks for Flexible Electronics,” Carbon Nanotube Networks for Flexible Electronics, Institute for Electronics and Nanotechnology (IEN) Seminar Series, Georgia Tech, Atlanta, Oct. 2016. (Invited)

  2. Kumar, S, “Electro-Thermal Transport in Carbon Nanostructure and Devices,” Air Force Research Lab. (AFRL), Oct. 2016, Dayton, IN, USA. (Invited)

  3. Kumar, S, “Thermal Transport Modeling and Metrology,” Xi'an Jiaotong University, Xian, China, May 2016. (Invited)

  4. Kumar, S, “Electro-Thermal Transport in Nano-Structures and Electronic Devices, Institute of High Performance Computing (IHPC), Singapore, January 2016. (Invited)

  5. Vallabhaneni A., Gupta M., and Kumar S., “Multiscale Modeling of Thermal and Electrical Transport in Gallium Nitride High Electron Mobility Transistor,” International Workshop on Nitride Semiconductors (IWN), Oct. 2016, Orlando, FL

  6. Chen, L., Chen S., Wang, X., and Kumar, S., “Understanding the Thermal Transport in Fullerene Composites,” MNHMT, Jan 4-6 2016, Bio-polis, Singapore.

  7. Yan, Z., Chen, L., Kumar, S., “Effect of Bonding on Phonon Transmission at Molybdenum Disulfide and Metal Interfaces”, MRS Fall Meeting & Exhibit, November 29-December 4, 2015, Boston, MA, USA.

  8. Yan, Z., Chen, L., Yoon, M., and Kumar, S., “Effect of Lattice Matching on Phonon Thermal Boundary Conductance at Graphene and Hexagonal Boron Nitride Interfaces”, ASME IMECE, November 13-19, 2015, Houston, TX, USA.

  9. Yan, Z., Chen, L., Yoon, M., Kumar, S., "Phonon Transmission and Thermal Boundary Conductance at Graphene and Hexagonal Boron Nitride Interface", ASME InterPACKICNMM, July 6-9, 2015, San Francisco, CA, USA

  10. Brown, D. B., Bougher, T. L., Cola, B. A., and Kumar, S., “Effect of Chemisorption and Physisorption on Thermal Boundary Conductance at Metal-graphene-metal Interfaces using Time-domain-thermoreflectance,” Tokyo Institute of Technology ACEEES Fourth International Education Forum on Environment and Energy Science, December, 6-10, 2015, Maui, HI, USA.

  11. Gupta, M., Kumar, S., "Numerical Investigation Of Electrical And Thermal Transport In Carbon Nanotube Array Transistors", ASME InterPACKICNMM, July 6-9, 2015, San Francisco, CA, USA

  12. Yan, Z., Chen, L., Kumar, S., “Phonon Transport at Molybdenum Disulfide and Metal Interface”, ASME IMECE, November 2014, Montreal, Canada

  13. Chen, L., Kumar, S., "Thermal Boundary Conductance between Carbon Nanotube and Silicon Oxide with Surface Functionalization", 11th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, June 2014, Atlanta, USA

  14. Gupta, M., Behnam, A., Estrada, D., Pop, E., Kumar, S.,“Size Effects on Heat Dissipation and Thermal Reliability of Carbon Nanotube Thin Film Transistors”, MRS Spring Meetings and Exhibits 2013, San Francisco, CA, USA

  15. Gupta, M., Kumar, S., "Dissipative Particle Dynamics Study of Liquid Crystals under Electric Field", ASME MNHMT 2013, Hongkong, China

 

Book Chapters

  1. Alam, M. A, and Kumar, S., Flexible Electronics in Encyclopedia of Nanotechnology, Springer Publications, pp 860, 2012. (Invited)

  2. Kumar, S., Alam, M. A., and Murthy, J. Y., Simulation of Thermal and Electrical Transport in Nanotube and Nanowire Composites in Advanced Structured Materials, Springer publications, 2011. (Invited )         (DOI: 10.1007/8611_2011_61)

Other Publications

  1. B.A. Cola, H. Daiguji, C. Dames, N. Fang, K. Fushinobu, S. Inoue, G. Kikugawa, M. Kohno, S. Kumar, D.Y. Li, J.R. Lukes, J.A. Malen, A.J. McGaughey, O. Nakabeppu, K. Pipe, P. Reddy, S. Shen, L. Shi, M. Shibahara, Y. Taguchi, K. Takahashi, T. Yamamoto, T. Zolotoukhina. Report on the Seventh U.S.-Japan Joint Seminar on Nanoscale Transport Phenomena-Science and Engineering. Nanoscale and Microscale Thermophysical Engineering, 17:25-49, 2013.